Products

Key Features

1. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor
2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4 RDIMM/LRDIMM
3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
4. 10 Hot-swap 2.5" SATA3 drive bays + 2 hybrid NVMe (2 hybrid NVMe w/ AOC option)
5. 2x 10GBase-T ports with Intel X722 + X557
6. 1 VGA, 1 COM, 4 USB 3.0, 2 USB 2.0
7. 500W Redundant Platinum Level power supplies

Key Features

1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP.
2. 8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® Intel® DCPMM
3. 2 PCIe 4.0 x16 (FHFL) slots, 1 PCIe 4.0 x16 (LP) slot
4. Intel® Ethernet Controller X550 2x 10GbE RJ45
5. 8x hot-swap 2.5'' SATA3 drive bays with 4 hybrid NVMe/SATA drive bays, SAS3 with additional SAS controller card; Onboard 1x NVMe/SATA M.2
6. Redundant Platinum 650W Power Supply

Key Features

1. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor
2. 6 DIMMs; up to 1.5TB 3DS ECC DDR4 RDIMM/LRDIMM
3. 2 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (LP) slot
4. 10 Hot-swap 2.5" SATA3 drive bays + 2 hybrid NVMe (AOC option included)
5. 2x 10GBase-T ports with Intel X722 + X557
6. 1 VGA, 1 COM, 4 USB 3.0, 2 USB 2.0
7. 500W Redundant Platinum Level power supplies

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
3. 2x PCIe 4.0 x16 (FH, 10.5"L); 1x PCIe 4.0 x16 (LP); 1x Internal PCIe 4.0 x16
4. 2-Port 10GBase-T RJ45
5. 12x2.5" hot-swap hybrid NVMe/SATA/SAS drive bays
6. 1200W Redundant Titanium level Power Supplies

Key Features

1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP
2. 16 DIMM slots, Up to 4TB DDR5-5600MHZ/4800MHz ECC Registered RDIMM
3. 4 PCIe 5.0 x16 Low Profile (LP), 2 PCIe 5.0 x8 Low Profile (LP)
4. Broadcom BCM5720 Dual ports 1G LAN
5. 8x hot-swap 3.5'' SATA3 drive bays, SAS3 with additional SAS controller card; Onboard: 2x PCIe 4.0 x2
6. 1200W Redundant Titanium level Power Supplies

1. Single Socket E (LGA-4677) 4th/5th Gen Intel®  Xeon® Scalable processors. Up to 350W TDP
2. Intel® C741 Chipset
3. 16 DIMMs; Supports 3DS DDR5 RDIMM. Up to 5600 MHz
4. Dual AIOM (OCP 3.0) for networking (NCSI available), 1 dedicated IPMI LAN
5. 10x front hot-swap 2.5" SATA3 drive bays (Optional all 10 hybrid Gen5 NVMe), SAS3 with additional SAS controller card
6. Redundant Now Titanium 860W Power Supplies