SYS-F629P3-RTB |
Supermicro Fat Twin 4U 4 node |
4 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
8x 3.5" Hot-swap SATA3 |
Must bundle with at least one SIOM network card |
1200W high-efficiency Titanium Level redundant power supply w/ PMBus |
SYS-F628R3-RTB+ |
Supermicro FatTwin 2U node, half width. |
4 |
2 |
- Intel® Xeon® processor E5-2600 V4 with UPI up to 9.6GT/s
|
Intel® C612 chipset |
- 1TB Registered ECC, DDR4 2400MHz in 16 DIMM slots
|
8x 3.5" SATA3 |
Intel® i350-AM2 Dual Port Gigabit Ethernet |
1280W Redundant Platinum Level (95%+) Digital High-efficiency Power Supplies with I2C & PMBus. |
SYS-F628R3-R72B+ |
Supermicro Fat Twin 4U 4 node |
4 |
2 |
- Intel® Xeon® processor E5-2600 V4 with UPI up to 9.6GT/s
|
Intel® C612 chipset |
- 1TB Registered ECC, DDR4-2400MHz in 16 DIMM slots
|
8x 3.5" |
Intel® i350-AM2 Dual Port Gigabit Ethernet |
1280W Redundant High-efficiency Digital Power Supplies w/ PMBus 1.2 |
SYS-F619P2-RT |
Supermicro Fat Twin 4U 8 node |
8 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 165W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
6x 2.5" Hot-swap SATA3 |
Must bundle with at least one SIOM network card |
2200W high-efficiency Titanium Level redundant power supply w/ PMBus |
SYS-7049P-TR |
2U Rackmount Standard Barebone Mainstream Server |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
8x 3.5" hot-swap SATA3 drive bay |
Dual LAN RJ45 ports with Intel® X722 Gigabit Ethernet Controller; 1x Dedicated IPMI LAN RJ45 port |
2x Super Quiet 1280W Redundant Power Supply modules, high-efficiency Platinum Level (94% typical efficiency ), |
SYS-7049GP-TRT |
4U Rackmount/Workstation 462 x 178 x 673mm (18.2" x 7.0" x 26.5") |
1 |
2 |
- Intel Xeon Scalable Processors with UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
8 Hot-swap 3.5" Drive Bays; (2x SATA3 ports default) |
2 10GBase-T ports; Intel® X550 10GBase-T |
2200W Titanium Level efficiency redundant power supplies |
SYS-7049A-T |
4U Tower or Rackmount |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel C621 |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
8x 3.5" hot-swap SAS/SATA drive bays (SAS requires optional RAID card) |
Dual GbE LAN from C621 |
1200W High-efficiency (Platinum level) PWS |
SYS-7048GR-TR |
4U |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 160W, 1 QPI up to 9.6GT/s
|
Intel® C612 chipset |
- Up to 16x 288-pin DDR4 DIMM slots ,<br> Up to 2TB† ECC 3DS LRDIMM, 1TB ECC RDIMM
|
8x Hot-swap 3.5" SAS/SATA Drives |
Dual LAN with Intel I350 Gigabit Ethernet controller; Matrox G200ew graphics |
1620W Redundant Platinum Level high-efficiency power supplies with I2C & PMBus |
SYS-7048A-T |
4U 452 x 178 x 647mm (17.8"x7"x25.5") |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 160W, 1 QPI up to 9.6GT/s
|
Intel® C612 chipset |
- Up to 1TB 3DS ECC/non-ECC RDIMM, DDR4-2400MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
|
8x 3.5" hot-swap SAS/SATA drive bay (SAS requires optional RAID card) |
Dual LAN with Intel® i210 Gigabit Ethernet Controller |
PWS-1K25P-PQ |
SYS-7039A-I |
Mid-Tower |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
4x 3.5" fixed drive bay, optional 4x 2.5" fixed drive bay |
Dual GbE LAN from C621 |
1200W High-efficiency (Platinum level) PWS |
SYS-7038A-I |
Mid-Tower 424mm x 193mm x 525mm (16.7"x7.6"x20.68") |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 160W, 1 QPI up to 9.6GT/s
|
Intel C612 chipset |
- Up to 1TB 3DS ECC/non-ECC RDIMM, DDR4-2400MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
|
4x 3.5" drive bays (internal) |
Dual LAN with Intel® i210 Gigabit Ethernet Controller |
900W Multi-Output Power Supply 80Plus Gold |
SYS-6029U-TRTP |
2U Rackmount |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
12 Hot-swap 3.5" Drive Bays; 12 SATA3 ports by default; Optional drive support: 8 SAS3 + 4 SAS3/NVMe; Optional 2 Rear Hot-swap 2.5" Drive Bays |
2 10G SFP+ ports with Intel® 82599ES Ethernet Controller; 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
1000W Redundant Power Supplies with PMBus |
SYS-6029U-TRT |
2U Rackmount |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
12 Hot-swap 3.5" Drive Bays; 12 SATA3 ports by default; Optional drive support: 8 SAS3 + 4 SAS3/NVMe; Optional 2 Rear Hot-swap 2.5" Drive Bays |
2 10GBase-T ports with Intel® X540 Ethernet Controller; 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
1000W Redundant Power Supplies with PMBus |
SYS-6029U-TR4T |
2U Rackmount |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
12 Hot-swap 3.5" Drive Bays; 12 SATA3 ports by default; Optional drive support: 8 SAS3 + 4 SAS3/NVMe; Optional 2 Rear Hot-swap 2.5" Drive Bays |
4 10GBase-T ports with Intel® XL710 Ethernet Controller; 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
1000W Redundant Power Supplies with PMBus |
SYS-6029U-TR4 |
2U Rackmount |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
12 Hot-swap 3.5" Drive Bays; 12 SATA3 ports by default; Optional drive support: 8 SAS3 + 4 SAS3/NVMe; Optional 2 Rear Hot-swap 2.5" Drive Bays |
4 GbE ports with Intel® i350 Ethernet Controller; 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
1000W Redundant Power Supplies with PMBus |
SYS-6029TP-HTR |
2U Rackmount 438 x 88 x 774mm (17.25” x 3.47” x 30.5”) |
4 |
2 |
- Dual Socket P (LGA 3647) 2nd Gen. Intel® Xeon® Scalable Processors (Cascade Lake/Skylake)‡, Dual UPI up to 10.4GT/s Support CPU TDP 70-165W*
|
Intel® C621 chipset |
- 16 DIMM slots Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM Supports Intel® Optane™ DCPMM††
|
Quad set of 3x 3.5” hot-swap SATA drive bays |
Quad set of single IPMI 2.0 + KVM with dedicated LAN only. Need one network card installed per node |
2200W Redundant Titanium Level high-efficiency Power Supplies with I2C & PMBus |
SYS-6029P-TR |
2U Rackmount Standard Barebone Mainstream Server |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
8x 3.5" hot-swap SATA3 drive bay |
Dual LAN RJ45 ports with Intel® X722 Gigabit Ethernet Controller; 1x Dedicated IPMI LAN RJ45 port |
2x Redundant 1000W Redundant Power Supply Titanium Level (96% typical efficiency) |
SYS-6028U-TRTP+ |
2U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
12 hot-swap 3.5" drive support |
2 10G SFP+; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 1000W Titanium Level (96%+) Power Supplies with PMBus |
SYS-6028U-TRT+ |
2U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
12 hot-swap 3.5" drive support |
2 10Gbase-T Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 1000W Titanium Level (96%+) Power Supplies with PMBus |
SYS-6028U-TR4T+ |
2U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
12 hot-swap 3.5" drive support |
4 10Gbase-T Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 1000W Titanium Level (96%+) Power Supplies with PMBus |
SYS-6028U-TR4+ |
2U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
12 hot-swap 3.5" drive support |
4 Gigabit Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 1000W Titanium Level (96%+) Power Supplies with PMBus |
SYS-6028TR-HTR |
2U Rackmount |
4 |
2 |
- Dual Intel® Xeon® processor E5-2600 V4/V3 with UPI up to 9.6GT/s; CPU TDP support up to 145W
|
Intel® C612 chipset |
- Quad set of 512 GB ECC LRDIMM,256 GB ECC RDIMM; DDR4-2400MHz in 8 DIMM slotss
|
Quad set of 3x 3.5" hot-swap SAS2/SATA3 |
Quad set of dual LAN with Intel I350 Gigabit Ethernet controller |
1600W Redundant Titaninum Level high-efficiency power supplies with I2C & PMBus |
SYS-6028TR-HTFR |
2U Rackmount |
4 |
2 |
- Dual Intel® Xeon® processor E5-2600 V4/V3 with UPI up to 9.6GT/s; CPU TDP support up to 145W
|
Intel® C612 chipset |
- Quad set of 512 GB ECC LRDIMM,256 GB ECC RDIMM; DDR4-2400MHz in 8 DIMM slots
|
Quad set of 3x 3.5" hot-swap SAS2/SATA3 |
Quad set of dual LAN with INTEL i350 Gigabit Ethernet controller plus Mellanox ConnectX3 single port FDR |
1600W Redundant Titaninum Level high-efficiency power supplies with I2C & PMBus |
SYS-6028TR-DTR |
2U Rackmount |
2 |
2 |
- Dual Intel® Xeon® processor E5-2600 V4/V3 with UPI up to 9.6GT/s; CPU TDP support up to 145W
|
Intel® C612 chipset |
- Dual set of 512 GB ECC LRDIMM,256 GB ECC RDIMM; DDR4-2400MHz in 8 DIMM slots
|
Dual set of 6x 3.5" hot-swap SAS2/SATA3 |
Dual set of dual LAN with Intel I350 Gigabit Ethernet controller |
1280W Redundant Platinum Level high-efficiency power supplies with I2C & PMBus |
SYS-6028TR-D72R |
2U Rackmount |
2 |
2 |
- Dual Intel® Xeon® processor E5-2600 V4/V3 with UPI up to 9.6GT/s; CPU TDP support up to 145W
|
Intel® C612 chipset |
- Dual set of 512 GB ECC LRDIMM,256 GB ECC RDIMM; DDR4-2400MHz in 8 DIMM slots
|
Dual set of 6x 3.5" hot-swap SAS2/SATA3 |
Dual set of dual LAN with Intel I350 Gigabit Ethernet controller |
1280W Redundant Platinum Level high-efficiency power supplies with I2C & PMBus |
SYS-6028TP-HTTR |
2U Rackmount 438 x 88 x 762mm (17.25” x 3.47” x 30”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 3x 3.5” hot-swap SATA drive bays |
Quad set of Dual LAN with Intel® X540 10GBase-T Ethernet Controller |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-6028TP-HTR |
2U Rackmount 438 x 88 x 762mm (17.25” x 3.47” x 30”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 3x 3.5” hot-swap SATA drive bays |
Quad set of Dual LAN with Intel® i350 Gigabit Ethernet controller |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-6028TP-HTFR |
2U Rackmount 438 x 88 x 762mm (17.25” x 3.47” x 30”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 3x 3.5” hot-swap SATA drive bays |
Quad set of FDR (Connect-X3) / 56G Ethernet |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-6028TP-HC1TR |
2U Rackmount 438 x 88 x 762mm (17.25” x 3.47” x 30”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 3x 3.5” hot-swap SATA drive bays |
Quad set of Dual LAN with Intel® i350 Gigabit Ethernet controller |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-6028TP-HC1R |
2U Rackmount 438 x 88 x 762mm (17.25” x 3.47” x 30”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 3x 3.5” hot-swap SATA drive bays |
Quad set of Dual LAN with Intel® i350 Gigabit Ethernet controller |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-6028TP-HC1FR |
2U Rackmount 438 x 88 x 762mm (17.25” x 3.47” x 30”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 3x 3.5” hot-swap SATA drive bays |
Quad set of FDR (Connect-X3) / 56G Ethernet |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-6028R-WTRT |
2U 17.2" (437mm) x 3.5" (89mm) x 25.5" (647mm) |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 145W, 1 QPI up to 9.6GT/s
|
Intel® C612 chipset |
- Up to 1TB DDR4 up to 2133MHz, in 16 DIMM slots
|
8x 3.5” hot-swap SAS/SATA drive bays |
Dual LAN with Intel® X540 10GBase-T Ethernet Controller |
740W Redundant Platinum Level high-efficiency power supplies with I2C & PMBus |
SYS-6028R-WTR |
2U 17.2" (437mm) x 3.5" (89mm) x 25.5" (647mm) |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 145W, 1 QPI up to 9.6GT/s
|
Intel® C612 chipset |
- Up to 1TB DDR4 up to 2133MHz, in 16 DIMM slots
|
8x 3.5” hot-swap SAS/SATA drive bays |
Dual LAN with Intel® i350 Gigabit Ethernet Controller |
740W Redundant Platinum Level high-efficiency power supplies with I2C & PMBus |
SYS-6028R-TR |
System Gross Weight: 31.2KG/69 Pounds; System Net Weight: 16KG/35.5 Pounds; System Dimension: H3.5"(8.9cm) x W17.2"(43.7m) x D25.5(64.8cm); Package Dimension: H26"(67cm) x W11"(29cm) x D34.5"(87cm) |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 145W, 2 QPI up to 9.6GT/s
|
Intel® C612 chipset |
- Up to Up to 1TB Registered ECC RDIMM, DDR4-2133MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slotsUp to 2TB† ECC 3DS LRDIMM, 1TB ECC RDIMM
|
8x 3.5" hot-swap SATA3 drive bay |
2x RJ45 Gigabit Ethernet LAN ports |
2x Redundant 740W Redundant Power, Platinum Level (94% typical efficiency ) |
SYS-6019U-TRTP2 |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
4 hot-swap 3.5" drive support |
2 Gigabit Ethernet ports; 2 10G SFP+ Ethernet ports; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level Power Supply |
SYS-6019U-TRTP |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
4 hot-swap 3.5" drive support |
2 10G SFP+ Ethernet ports; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level Power Supply |
SYS-6019U-TRT |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
4 hot-swap 3.5" drive support |
2 10GBase-T Ethernet ports; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level Power Supply |
SYS-6019U-TR4T |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
4 hot-swap 3.5" drive support |
4 10GBase-T Ethernet ports; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level Power Supply |
SYS-6019U-TR4 |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
4 hot-swap 3.5" drive support |
4 Gigabit Ethernet; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level Power Supply |
SYS-6019P-WTR |
1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
|
4x 3.5" hot-swap SATA3/SAS3 drive bays |
Dual 1G LAN ports, 1 dedicated IPMI port, 4 rear USB 3.0 ports |
Redundant 700/750W High-efficiency (Platinum Level) power supply |
SYS-6019P-MT |
1U Rackmount 437 x 43 x 508mm (17.2” x 1.7” x 19.98”) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
4 Hot-Swap 3.5" SATA3 6Gb/s |
2x 1GbE LAN Marvell 88E1512 PHY |
500W Single Power Supply, 80PLUS Platinum |
SYS-6018U-TRTP+ |
1U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
4 hot-swap 3.5" drive support |
2 port 10G SFP+ Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level (94%+) Power Supplies with PMBus |
SYS-6018U-TRT+ |
1U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
4 hot-swap 3.5" drive support |
2 port 10GBase-T Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level (94%+) Power Supplies with PMBus |
SYS-6018U-TR4T+ |
1U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
4 hot-swap 3.5" drive support |
4 10Gbase-T Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level (94%+) Power Supplies with PMBus |
SYS-6018U-TR4+ |
1U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
4 hot-swap 3.5" drive support |
4 Gigabit Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level (94%+) Power Supplies with PMBus |
SYS-6018R-WTRT |
1U Rackmount 437 x 43 x 650mm (17.2” x 1.7” x 25.6”) |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 145W, 1 QPI up to 9.6GT/s
|
Intel® C612 chipset |
- Up to 1TB DDR4 up to 2133MHz, in 16 DIMM slots
|
4x 3.5” hot-swap SAS/SATA drive bays |
Dual 10Gb Ethernet LAN with Intel® X540 Dual Port 10GBase-T |
700W Redundant Gold Level high-efficiency power supplies |
SYS-6018R-WTR |
1U Rackmount 437 x 43 x 650mm (17.2” x 1.7” x 25.6”) |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 145W, 1 QPI up to 9.6GT/s
|
Intel® C612 chipset |
- Up to 1TB DDR4 up to 2133MHz, in 16 DIMM slots
|
4x 3.5” hot-swap SAS/SATA drive bays |
Dual LAN with Intel® i350 Gigabit Ethernet Controller |
700W Redundant Gold Level high-efficiency power supplies |
SYS-6018R-TDW |
1U Rackmount 437 x 43 x 650mm (17.2” x 1.7” x 25.6”) |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4/v3 product family with UPI up to 9.6 GT/s
|
Intel® C612 Chipset |
- Up to 2TB ECC LRDIMM, 1TB ECC RDIMM, DDR4-2400MHz in 16 DIMM slots
|
4x 3.5” Hot-swap SATA3 Drive Bays |
Intel® i350 Dual-Port 1GbE LAN |
600W Platinum Level High-Efficiency Power Supply |
SYS-6018R-MTR |
1U Rackmount 437 x 43 x 503mm (17.2”x1.7”x19.8”) |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4/v3 product family with UPI up to 9.6 GT/s
|
Intel® C612 Chipset |
- Up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2400MHz in 8 DIMM slots
|
4x 3.5” Hot-swap SATA3 Drive Bays |
Intel® i210 Dual-Port 1GbE LAN |
400W Redundant Gold Level High-Efficiency Power Supplies |
SYS-6018R-MT |
1U Rackmount 437 x 43 x 503mm (17.2”x1.7”x19.8”) |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4/v3 product family with UPI up to 9.6 GT/s
|
Intel® C612 Chipset |
- Up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2400MHz in 8 DIMM slots
|
4x 3.5” Hot-swap SATA3 Drive Bays |
Intel® i210 Dual-Port 1GbE LAN |
480W Platinum Level High-Efficiency Power Supply |
SYS-5019S-WR |
1U rackmount 1.7” x 17.2” x 25.6” |
1 |
1 |
- Intel® 7th/6th Generation Core i3 series, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® processor E3-1200 v6/v5. <BR>Socket H4 (LGA 1151) supported, CPU TDP support 80W
|
Intel® C236 chipset |
- Up to 64GB Unbuffered ECC UDIMM, DDR4-2400MHz, in 4 DIMM slots
|
4x 3.5" hot-swap drive bay |
USB 2.0, USB 3.0, VGA, Serial |
PWS-504P-1R |
SYS-5019S-MR |
1U rackmount 1.7” x 17.2” x 19.8” |
1 |
1 |
- Intel® 7th/6th Generation Core i3 series, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® processor E3-1200 v6/v5. <BR>Socket H4 (LGA 1151) supported, CPU TDP support 80W
|
Intel® C236 chipset |
- Up to 64GB Unbuffered ECC UDIMM, DDR4-2400MHz, in 4 DIMM slots
|
4x 3.5" hot-swap SAS/SATA |
2x USB 3.0 (front/rear), USB 2.0, VGA, Serial |
PWS-407P-1R |
SYS-5019S-M |
1U Rackmount 1.7” x 17.2” x 19.8” |
1 |
1 |
- Intel® 7th/6th Generation Core i3 series, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® processor E3-1200 v6/v5. <BR>Socket H4 (LGA 1151) supported, CPU TDP support 80W
|
Intel® C236 chipset |
- Up to 64GB Unbuffered ECC UDIMM, DDR4-2400MHz, in 4 DIMM slots
|
4x 3.5" hot-swap SAS/SATA |
2x USB 3.0 (front/rear), USB 2.0, VGA, Serial |
PWS-350-1H |
SYS-5019S-L |
1U rackmount 1.7” x 17.2” x 11.3” (43 x 437 x 287 mm) |
1 |
1 |
- Intel® 7th/6th Generation Core i3 series, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® processor E3-1200 v6/v5. <BR>Socket H4 (LGA 1151) supported, CPU TDP support 80W
|
Intel® C232 chipset |
- Up to 64GB Unbuffered ECC UDIMM, DDR4-2400MHz, in 4 DIMM slots
|
Up to 1x internal 3.5”, 2x 2.5” drives (option) |
2x USB 2.0, USB 3.0, VGA, Serial |
PWS-203-1H |
SYS-5019P-WTR |
1U 17.2" (437mm) x 1.7" (43mm) x 25.6" (650mm) |
1 |
1 |
- Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).<br>Single Socket P (LGA 3647) supported, CPU TDP support 205W
|
Intel® C622 chipset |
- Up to Up to 384GB Registered ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
|
4x 3.5" hot-swap SAS/SATA |
Dual LAN with 10GBase-T with Intel® X722 + X557 |
PWS-504P-1R |
SYS-5019P-M |
1U 17.2" (437mm) x 1.7" (43mm) x 19.85" (503mm) |
1 |
1 |
- Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).<br>Single Socket P (LGA 3647) supported, CPU TDP support 165W
|
Intel® C621 chipset |
- Up to Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
|
4x 3.5" hot-swap SAS/SATA |
Dual LAN with 1GbE |
PWS-350-1H |
SYS-5018R-WR |
1U rackmount, 1.7" H x 17.2" W x 25.6" D (43mm H x 437mm W x 650mm D) |
1 |
1 |
- Intel® Xeon® Processor E5-1600 v3, Intel® Xeon® Processor E5-1600 v4, Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Single Socket R3 (LGA 2011) supported, CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Up to Up to 256GB Registered ECC RDIMM, DDR4-2400MHz; Up to 512GB LRDIMM LRDIMM, in 8 DIMM slotsUp to 1TB ECC 3DS LRDIMM<br> 8x 288-pin DDR4 DIMM slots
|
4x 3.5" hot-swap drive bay |
2x GbE port, 2x USB 2.0, USB 3.0, VGA, Serial |
PWS-504P-1R |
SYS-5018R-MR |
1U rackmount, 1.7" H x 17.2" W x 19.8" D (43mm H x 437mm W x 503mm D) |
1 |
1 |
- Intel® Xeon® Processor E5-1600 v3, Intel® Xeon® Processor E5-1600 v4, Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4<br>Single Socket LGA-2011-3 (Socket R3) supported, CPU TDP support Up to 145W TDP
|
Intel® C612 chipset |
- Up to Up to 256GB Registered ECC RDIMM, DDR4-2400MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2400MHz, in 8 DIMM slots
|
4x 3.5" hot-swap SAS/SATA |
4x USB 2.0 (front/rear), USB 3.0, VGA, Serial2x GbE port, 1x dedicated IPMI port |
PWS-407P-1R |
SYS-5018R-M |
1U rackmount, 1.7" H x 17.2" W x 19.8" D (43mm H x 437mm W x 503mm D) |
1 |
1 |
- Intel® Xeon® Processor E5-1600 v3, Intel® Xeon® Processor E5-1600 v4, Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4<br>Single Socket LGA-2011-3 (Socket R3) supported, CPU TDP support Up to 145W TDP
|
Intel® C612 chipset |
- Up to Up to 256GB Registered ECC RDIMM, DDR4-2400MHz; Up to 512GB LRDIMM LRDIMM, DDR4-2400MHz, in 8 DIMM slots
|
4x 3.5" hot-swap SAS/SATA |
4x USB 2.0 (front/rear), USB 3.0, VGA, Serial |
350W High-Efficiency Power Supply |
SYS-4029GP-TRT2 |
4U |
1 |
2 |
|
|
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only) ;<BR>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake onl
|
24x 2.5" Hot-swap SATA/SAS drives |
2x 10GBase-T ports; Intel® X540 10GBase-T |
4 x 2000W Redundant Titanium Level high-efficiency power supplies with I2C & PMBus |
SYS-4029GP-TRT |
4U Rackmount |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<BR>Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
|
Intel® C622 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots(2933MHz in two DIMMs per channel supported on Rev 1.10 MB only) ;<BR>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake onl
|
24 x 2.5" Hot-swap SATA/SAS drives |
2x 10GBase-T ports; Intel® X540 10GBase-T |
2000W(2+2) Redundant Power Supplies Titanium Level (96%+) |
SYS-2029U-TRTP |
2U Rackmount |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
24 Hot-swap 2.5" Drive Bays; 14 SATA3 ports by default; Optional drive support: 20 SAS3 + 4 SAS3/NVMe; Optional 2 Rear Hot-swap 2.5" Drive Bays |
2 10G SFP+ ports with Intel® 82599ES Ethernet Controller; 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
1000W Redundant Power Supplies with PMBus |
SYS-2029U-TRT |
2U Rackmount |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
24 Hot-swap 2.5" Drive Bays; 14 SATA3 ports by default; Optional drive support: 20 SAS3 + 4 SAS3/NVMe; Optional 2 Rear Hot-swap 2.5" Drive Bays |
2 10GBase-T ports with Intel® X540 Ethernet Controller; 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
1000W Redundant Power Supplies with PMBus |
SYS-2029U-TR4T |
2U Rackmount |
1 |
2 |
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, <br>Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
24 Hot-swap 2.5" Drive Bays; 14 SATA3 ports by default; Optional drive support: 20 SAS3 + 4 SAS3/NVMe; Optional 2 Rear Hot-swap 2.5" Drive Bays |
4 10GBase-T ports with Intel® XL710 Ethernet Controller; 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
1000W Redundant Power Supplies with PMBus |
SYS-2029U-TR4 |
2U Rackmount |
1 |
2 |
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, <br>Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
24 Hot-swap 2.5" Drive Bays; 14 SATA3 ports by default; Optional drive support: 20 SAS3 + 4 SAS3/NVMe; Optional 2 Rear Hot-swap 2.5" Drive Bays |
4 GbE ports with Intel® i350 Ethernet Controller; 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
1000W Redundant Power Supplies with PMBus |
SYS-2029TP-HTR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.5”) |
4 |
2 |
|
Intel® C621 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
Quad set of 6x 2.5” hot-swap SATA drive bays |
Quad set of single IPMI 2.0 + KVM with dedicated LAN only. Need one network card installed per node |
2200W Redundant Titanium Level high-efficiency Power Supplies with I2C & PMBus |
SYS-2029BT-HNR |
2U (4-node) Rackmount |
4 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
6 Hot-swap 2.5" NVMe drive bays per node |
SIOM Networking Card For Flexible Networking Options |
Redundant 2200W Titanium Level high-efficiency power supplies with I2C&PMbus |
SYS-2029BT-HNC0R |
2U (4-node) Rackmount |
4 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
4 Hot-swap 2.5" NVMe/SAS drive bays + 2 Hot-swap 2.5" SAS drive bays per node |
SIOM Networking Card For Flexible Networking Options |
Redundant 2200W Titanium Level high-efficiency power supplies with I2C&PMbus |
SYS-2028U-TRTP+ |
2U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
24 hot-swap 2.5" drive support |
2 10G SFP+ Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 1000W Titanium Level (96%+) Power Supplies with PMBus |
SYS-2028U-TRT+ |
2U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
24 hot-swap 2.5" drive support |
2 10Gbase-T Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 1000W Titanium Level (96%+) Power Supplies with PMBus |
SYS-2028U-TR4T+ |
2U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
24 hot-swap 2.5" drive support |
4 10Gbase-T Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 1000W Titanium Level (96%+) Power Supplies with PMBus |
SYS-2028U-TR4+ |
2U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
24 hot-swap 2.5" drive support |
4 Gigabit Ethernet; 5 USB 3.0 ports (2 rear, 2 onboard header, 1 Type A); 1 Serial Port |
Redundant 1000W Titanium Level (96%+) Power Supplies with PMBus |
SYS-2028TR-H72R |
2U Rackmount |
4 |
2 |
- Dual Intel® Xeon® processor E5-2600 V4/V3 with UPI up to 9.6GT/s; CPU TDP support up to 145W
|
Intel® C612 chipset |
- Quad set of 512 GB ECC LRDIMM,256 GB ECC RDIMM; DDR4-2400MHz in 8 DIMM slots
|
Quad set of 6x 2.5" hot-swap SAS/SATA drive bay |
Quad set of dual LAN with INTEL i350 Gigabit Ethernet controller |
1600W Redundant Titanium Level high-efficiency power supplies with I2C & PMBus |
SYS-2028TR-H72FR |
2U Rackmount |
4 |
2 |
- Dual Intel® Xeon® processor E5-2600 V4/V3 with UPI up to 9.6GT/s; CPU TDP support up to 145W
|
Intel® C612 chipset |
- Quad set of 512 GB ECC LRDIMM,256 GB ECC RDIMM; DDR4-2400MHz in 8 DIMM slots
|
Quad set of 6x 2.5" hot-swap SAS/SATA drive bay |
Quad set of dual LAN with INTEL i350 Gigabit Ethernet controller plus Mellanox ConnectX3 single port FDR |
1600W Redundant Titanium Level high-efficiency power supplies with I2C & PMBus |
SYS-2028TP-HTTR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 6x 2.5” hot-swap SATA drive bays |
Quad set of Dual LAN with Intel® X540 10GBase-T Ethernet Controller |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-2028TP-HTR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 6x 2.5” hot-swap SATA drive bays |
Quad set of Dual LAN with Intel® i350 Gigabit Ethernet controller |
2000W Redundant Titanium/PlatinumLevel high-efficiency Power Supplies with I2C & PMBus |
SYS-2028TP-HTFR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 6x 2.5” hot-swap SATA drive bays |
Quad set of FDR (Connect-X3) / 56G Ethernet |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-2028TP-HC1TR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 6x 2.5” hot-swap SATA drive bays |
Quad set of Dual 10Gb Ethernet LAN with Intel® X540 and 10GBase-T Connector |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-2028TP-HC1R |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 6x 2.5” hot-swap SATA drive bays |
Quad set of Dual LAN with Intel® i350 Gigabit Ethernet controller |
2000W Redundant Titanium / Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-2028TP-HC1FR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
4 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Quad set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Quad set of 6x 2.5” hot-swap SATA drive bays |
Quad set of FDR (Connect-X3) / 40G Ethernet |
2000W Redundant Platinum Level high-efficiency Power Supplies with I2C & PMBus |
SYS-2028TP-DTTR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
2 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Twin set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Twin set of 8x 2.5” hot-swap SATA drive bays |
Twin set of Dual 10Gb Ethernet LAN with Intel® X540 and 10GBase-T Connector |
1280W Redundant Platinum Level Digital high-efficiency power supplies with I2C & PMBus |
SYS-2028TP-DTR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
2 |
2 |
- Twin sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Twin set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Twin set of 8x 2.5” hot-swap SATA drive bays |
Twin set of Dual LAN with Intel® i350 Gigabit Ethernet controller |
1280W Redundant Platinum Level Digital high-efficiency power supplies with I2C & PMBus |
SYS-2028TP-DTFR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
2 |
2 |
- Quad sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Twin set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Twin set of 8x 2.5” hot-swap SATA drive bays |
Twin set of FDR (Connect-X3) / 40G Ethernet |
1280W Redundant Platinum Level Digital high-efficiency power supplies with I2C & PMBus |
SYS-2028TP-DNCTR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
2 |
2 |
- Twin sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Twin set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Twin set of 4x NVMe and 8x 2.5” hot-swap SAS drives. |
Twin set of Dual 10Gb Ethernet LAN with Intel® X540 and 10GBase-T Connector |
1280W Redundant Platinum Level Digital high-efficiency power supplies with I2C & PMBus |
SYS-2028TP-DNCR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
2 |
2 |
- Twin sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Twin set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Twin set of 4x NVMe and 8x 2.5” hot-swap SAS drives. |
Twin set of Dual LAN with Intel® i350 Gigabit Ethernet controller |
1280W Redundant Platinum Level Digital high-efficiency power supplies with I2C & PMBus |
SYS-2028TP-DNCFR |
2U Rackmount 438 x 88 x 724mm (17.25” x 3.47” x 28.75”) |
2 |
2 |
- Twin sets of Intel® Xeon® processor E5-2600 V3 Socket R3 (LGA 2011) supported; UPI up to 9.6GT/s; CPU TDP support Up to 145W
|
Intel® C612 chipset |
- Twin set of up to 1TB ECC LRDIMM, 512GB ECC RDIMM, DDR4-2133MHz in 16 DIMM slots.
|
Twin set of 4x NVMe and 8x 2.5” hot-swap SAS drives. |
Twin set of FDR (Connect-X3) / 56G Ethernet |
1280W Redundant Platinum Level Digital high-efficiency power supplies with I2C & PMBus |
SYS-2028GR-TR |
2U 17.2" (437mm) x 3.5" (89 mm) x 31" (787 mm) |
1 |
2 |
- Intel® Xeon® processor E5-2600 v3, Intel® Xeon® processor E5-2600 v4.<br>Dual Socket R3 (LGA 2011) supported, CPU TDP support Up to 145W
|
Intel® C612 chipset |
|
10 x 2.5" hot-swap SAS/SATA drive bay |
N/A |
1600W Platinum level efficiency redundant power supplies |
SYS-1029U-TRTP2 |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
10 hot-swap 2.5" drive bays; 10 SAS3 ports support via AOC |
2 10G SFP+ Ethernet; 2 Gigabit Ethernet; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
750W Redundant Platinum Level Power Supply |
SYS-1029U-TRTP |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
10 hot-swap 2.5" drive bays; 10 SAS3 ports support via AOC |
2 10G SFP+ Ethernet; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
750W Redundant Platinum Level Power Supply |
SYS-1029U-TRT |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
10 hot-swap 2.5" drive bays; 10 SAS3 ports support via AOC |
2 10GBase-T Ethernet; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
750W Redundant Platinum Level Power Supply |
SYS-1029U-TR4T |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
10 hot-swap 2.5" drive bays; 10 SAS3 ports support via AOC |
4 10GBase-T Ethernet; 2 VGA ports (1 rear, 1 onboard) 3 USB 3.0 ports (2 rear, 1 Type A); 1 Serial Port |
750W Redundant Platinum Level Power Supply |
SYS-1029U-TR4 |
1U Chassis |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
10 hot-swap 2.5" drive support |
4 Gigabit Ethernet; 2 VGA ports (1 rear, 1 onboard) 5 USB 3.0 ports (2 rear, 2 front, 1 Type A); 1 Serial Port |
750W Redundant Platinum Level Power Supplies |
SYS-1029P-WTRT |
1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C622 chipset |
- Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
10x 2.5" hot-swap SATA3/SAS3 drive bays, 2x 2.5" hot-swap NVMe/SAS3/SATA3 hybrid drive bays |
Dual 10GBaseT LAN ports, 1 dedicated IPMI port, 4 rear USB3.0 ports, 2 front USB 3.0 ports |
Redundant 700/750W high-efficiency (Platinum Level) power supply |
SYS-1029P-WTR |
1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
|
8x 2.5" hot-swap SATA3/SAS3 drive bays |
Dual 1G LAN ports, 1 dedicated IPMI port, 4 rear USB 3.0 ports |
Redundant 700/750W High-efficiency (Platinum Level) power supply |
SYS-1029P-MTR |
1U Rackmount 437 x 43 x 508mm (17.2” x 1.7” x 19.98”) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<BR>Dual Socket P (LGA 3647) supported, CPU TDP support Up to 140W, 2 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
|
8x Hot-Swap 2.5” SATA3 6Gb/s |
2x 1GbE LAN Marvell 88E1512 PHY |
800W Redundant Power Supply, 80PLUS Platinum |
SYS-1029GQ-TRT |
1U Rackmount 437 x 43 x 894mm (17.2" x 1.7" x 35.2") |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
|
2x 2.5" hot-swap SAS/SATA drive bay; 2x 2.5" Internal SATA Fixed drive bay |
2x 10GBase-T ports; Intel® X540 10GBase-T |
2000W Titanium level efficiency redundant power supplies |
SYS-1028U-TRT+ |
1U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
10 hot-swap 2.5" drive support |
2 10Gbase-T Ethernet; 5 USB 3.0 ports (2 rear, 2 front, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level (94%+) Power Supplies with PMBus |
SYS-1028U-TR4T+ |
1U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
10 hot-swap 2.5" drive support |
4 10Gbase-T Ethernet; 5 USB 3.0 ports (2 rear, 2 front, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level (94%+) Power Supplies with PMBus |
SYS-1028U-TR4+ |
1U Chassis |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4 / v3 product family with QPI up to 9.6 GT/s
|
Intel® C612 chipset |
- Up to 3TB ECC 3DS LRDIMM or RDIMM DDR4-2400 in 24 DIMM slots
|
10 hot-swap 2.5" drive support |
4 Gigabit Ethernet; 5 USB 3.0 ports (2 rear, 2 front, 1 Type A); 1 Serial Port |
Redundant 750W Platinum Level (94%+) Power Supplies with PMBus |
SYS-1028R-WTRT |
1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) |
1 |
2 |
- Intel® Xeon® processor E5-2600 V3 with UPI up to 9.6GT/s
|
Intel C612 Chipset |
- Up to 1TB DDR4 up to 2133MHz, in 16 DIMM slots
|
10x 2.5" hot-swap SAS/SATA drive bay |
Intel I350 Dual port Gigabit or 10Gbase-T X540 10GbE LAN |
PWS-704P-1R |
SYS-1028R-WTR |
1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) |
1 |
2 |
- Intel® Xeon® processor E5-2600 V3 with UPI up to 9.6GT/s
|
Intel C612 Chipset |
- 16 DIMM,1024GB Reg. ECC DDR4 up to 2133MHz
|
10x 2.5" hot-swap SAS/SATA drive bay |
2x RJ45 Gigabit Ethernet LAN ports |
PWS-706P-1R |
SYS-1028R-TDW |
1U Rackmount 437 x 43 x 650mm (17.2” x 1.7” x 25.6”) |
1 |
2 |
- Dual Intel® Xeon® Processor E5-2600 v4/v3 product family with UPI up to 9.6 GT/s
|
Intel® C612 Chipset |
- Up to 2TB ECC LRDIMM, 1TB ECC RDIMM, DDR4-2400MHz in 16 DIMM slots
|
8x 2.5” Hot-swap SATA3 Drive Bays |
Intel® i350 Dual-Port 1GbE LAN |
600W Platinum Level High-Efficiency Power Supply |
SYS-1028GR-TR |
1U 17.2" (437mm) x 1.7" (43 mm) x 30.6" (777 mm) |
1 |
2 |
- Intel® Xeon® processor E5-2600 V3 with UPI up to 9.6GT/s
|
Intel® C612 chipset |
|
4 x 2.5" hot-swap SAS/SATA drive bay |
N/A |
1600W Platinum level efficiency redundant power supplies |
SYS-1019P-WTR |
1U 17.2" (437mm) x 1.7" (43mm) x 23.5" (597mm) |
1 |
1 |
- Intel® Xeon® Scalable Processors (Cascade Lake/Skylake).<br>Single Socket P (LGA 3647) supported, CPU TDP support 205W
|
Intel® C622 chipset |
- Up to Up to 384GB Registered ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots
|
10x 2.5" hot-swap SAS/SATA drive bay |
Dual LAN with 10GBase-T with Intel® X722 + X557 |
PWS-504P-1R |
SSG-6049P-E1CR60L+ |
4U Rackmount 17.2" (437mm) x 7" (178mm) x 30.2" (767.08mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<BR>Dual Socket P (LGA 3647) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz <BR>Or 2TB DCPMM, DDR4-2666MHz, in 24 DIMM slots;<BR>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
60x 3.5" hot-swap SAS/SATA drive bay with SES3 |
N/A |
PWS-2K05A-1R |
SSG-6049P-E1CR60H |
4U Rackmount 17.2" (437mm) x 7" (178mm) x 30.2" (767.08mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
60x 3.5"/2.5" hot-swap SAS3/SATA3 drive bays |
N/A |
Dual redundant 2000W Titanium power supplies |
SSG-6049P-E1CR45L |
4U Rackmount 17.2" (437mm) x 7" (178mm) x 26" (660mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
45x 3.5" hot-swap SAS/SATA drive bay with SES3 |
N/A |
PWS-1K66P-1R |
SSG-6049P-E1CR45H |
4U Rackmount 17.2" (437mm) x 7" (178mm) x 26" (660mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C621 chipset |
- Up to Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots;<br>Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
|
45x 3.5" hot-swap SAS/SATA drive bay with SES3 |
N/A |
PWS-1K66P-1R |
SSG-6049P-E1CR36L |
4U 17.2" (437mm) x 7" (178mm) x 27.5" (699mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C622 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
36x 3.5" hot-swap SAS3/SATA3 drive bays |
Dual LAN with 10GBase-T with Intel® X557 |
1200W Titanium Level high-efficiency power supply |
SSG-6049P-E1CR36H |
4U 17.2" (437mm) x 7" (178mm) x 27.5" (699mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C622 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
36x 3.5" hot-swap SAS3/SATA3 drive bays |
Dual LAN with 10GBase-T with Intel® X557 |
1200W Titanium Level high-efficiency power supply |
SSG-6029P-E1CR12T |
2U 17.2" (437mm) x 3.5" (89mm) x 25.5" (647mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C622 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
12x 3.5" hot-swap SAS3/SATA3 drive bays |
Dual LAN with 10GBase-T with Intel® X557 |
1200W Titanium Level high-efficiency power supply |
SSG-6029P-E1CR12L |
2U 17.2" (437mm) x 3.5" (89mm) x 25.5" (647mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C622 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
12x 3.5" hot-swap SAS3/SATA3 drive bays |
Dual LAN with 10GBase-T with Intel® X557 |
1200W Titanium Level high-efficiency power supply |
SSG-6029P-E1CR12H |
2U 17.2" (437mm) x 3.5" (89mm) x 25.5" (647mm) |
1 |
2 |
- 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.<br>Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
|
Intel® C622 chipset |
- Up to Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz, in 16 DIMM slots;<br>Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only);<br>
|
12x 3.5" hot-swap SAS3/SATA3 drive bays |
Dual LAN with 10GBase-T with Intel® X557 |
1200W Titanium Level high-efficiency power supply |